ANZA MODEL 251 ESD SAFE MANUAL WIRE BONDER
110 VAC to 240 VAC
Photo cell sensor
This machine bonds both bare and insulated fine wire. Bonding through the existing insulation eliminates the need for mechanical, chemical, thermal or laser stripping. These machines are being used in production facilities in the U.S., Europe and the Far East.
A typical application is affixing bifilar or trifilar leads to thin-film heads for computer hard disk drives. This application uses 1-2 mil gold-plated copper wire with polyurethane insulation of approximately 1/10th-mil thickness. Contact pads are pure gold-plated and typically 4-mil by 7-mil in area. Insulated fine wires are essential in this application because of a need to use twisted wires for noise exclusion, low resistance and strength.
BONDING OF INSULATED AND BARE WIRE
Bare gold or plated single-wires are relatively easy to handle. They can be clamped and manipulated by automatic machines. Nothing needs to be added or removed in bonding to the gold surfaces. The enormous production of such devices as integrated circuits can justify expensive automatic machinery. By comparison, multiple insulated wires cannot be clamped and requires removal or penetration of the insulation.
The MODEL 251 bond counter indicates the running count of bonds produced and holds that number in memory even when the machine is turned off. It is equipped with an internal reset button that cannot accidentally be activated by the operator.
Operating variables are bond pressure, ultrasonic power and bonding time. All of these variables are easily adjusted.
Quality control testing is by electrical test of the finished encapsulated bond. Encapsulation eliminates mechanical stress and fatigue of the bond.
Power Requirements I 110VAC - 240VAC, 50/60 Hz, IA
Materials Bonded Gold-plated Copper, Gold, Copper, Aluminum
Range of Wire Sizes 0.001 to 0.005 inches
Dimensions 21 inches Wide, 17 inches Deep, 10 inch